@article {31, title = {Estimation of Defects Based on Defect Decay Model: ED^\{3\}M}, journal = {IEEE Transactions on Software Engineering}, volume = {34}, year = {2008}, pages = {336 - 356}, abstract = {

An accurate prediction of the number of defects in a software product during system testing contributes not only to the management of the system testing process but also to the estimation of the product{\textquoteright}s required maintenance. Here, a new approach called ED3M is presented that computes an estimate of the total number of defects in an ongoing testing process. ED3M is based on estimation theory. Unlike many existing approaches the technique presented here does not depend on historical data from previous projects or any assumptions about the requirements and/or testers{\textquoteright} productivity. It is a completely automated approach that relies only on the data collected during an ongoing testing process. This is a key advantage of the ED3M approach, as it makes it widely applicable in different testing environments. Here, the ED3M approach has been evaluated using five data sets from large industrial projects and two data sets from the literature. In addition, a performance analysis has been conducted using simulated data sets to explore its behavior using different models for the input data. The results are very promising; they indicate the ED3M approach provides accurate estimates with as fast or better convergence time in comparison to well-known alternative techniques, while only using defect data as the input.

}, keywords = {Costs, defect decay model, defect estimation, Defect prediction, estimation theory, Inspection, Metrics/Measurement, Phase estimation, Productivity, program testing, Programming, Software maintenance, software metrics, software product, Software systems, Software testing, Statistical methods, System testing, system testing process, Testing and Debugging}, doi = {10.1109/TSE.2008.23}, author = {Haider, Syed and Cangussu, Jo{\~a}o and Cooper, Kendra and Ram Dantu} } @article {277, title = {Micromanipulator vision for wafer probing}, journal = {IEEE Transactions on Semiconductor Manufacturing}, volume = {2}, year = {1989}, month = {08/1989}, pages = {114-117}, abstract = {

An overview is presented of a micromanipulator vision system for use in automating various functions during the testing of a wafer for semiconductor parameters and inspection of VLSI circuits. It is assumed that the wafer under test is not necessarily in its proper orientation. It is required that certain probes be lowered automatically onto certain pads to inject test vectors and to read the results for analysis. A methodology was developed for determining the position (especially the vertical distance from the target) of the tip of a probe, so that it can be guided accurately to its target pad. Standard image processing steps used for efficient feature extraction and registration of the target integrated circuit are outlined, and a method of obtaining the vertical distance of the tip of a probe from its target pad is presented. Two different criteria through which it can be established whether a probe is in contact with its target are given. The algorithm developed was tested for touch using different types of tips such as tungsten and tungsten carbide, and with NMOS and CMOS processes. Clean and accurate representations of the probes were extracted from integrated images in all the tests, and in all cases, touch was achieved without the surface being scratched

}, keywords = {Automatic testing, automating various functions, Circuit testing, CMOS processes, computer vision, computerised picture processing, efficient feature extraction, image processing steps, Inspection, inspection of VLSI circuits, Machine vision, micromanipulator vision system, Micromanipulators, NMOS ICs, overview, Probes, registration, Semiconductor device testing, System testing, Tungsten, vertical distance, Very large scale integration, VLSI, W tip, wafer probing, WC tip}, issn = {0894-6507}, doi = {10.1109/66.29680}, author = {Ram Dantu and Dimopoulos, Nikitas and Patel, Rajni and Al-Khalili, Asim} } @conference {284, title = {A micro-manipulator vision in IC Manufacturing}, booktitle = {Proceedings. 1988 IEEE International Conference on Robotics and Automation}, year = {1988}, month = {Apr}, abstract = {

An overview is presented of a micromanipulator vision system for use in automating various functions during the testing of a wafer for semiconducting parameters and inspection of VLSI circuits. Positioning the probe and touching a test pad are the chief concern of the work desired. A brief description of the experimental setup is given. The image processing techniques used in identifying and controlling the location of various components such as the probes and the test pads are discussed. The vision modules and an expert system using hierarchical plan generation to control the sequence of plans are included

}, keywords = {Automatic testing, Circuit testing, computer vision, computer vision module, computerised pattern recognition, expert system, expert systems, IC Manufacturing, image processing, industrial robots, Inspection, integrated circuit manufacture, integrated circuit testing, Machine vision, Manufacturing, micromanipulator vision, Micromanipulators, Probes, robots, Semiconductivity, Semiconductor device manufacture, Semiconductor device testing, System testing, test pads, VLSI, wafer testing}, doi = {10.1109/ROBOT.1988.12271}, author = {Ram Dantu and Dimopoulos, Nikitas and Patel, Rajni and Al-Khalili, Asim} }