@article {275, title = {Parallel algorithms for low-level vision on the homogeneous multiprocessor}, journal = {Computers \& Electrical Engineering}, volume = {20}, year = {1994}, pages = {51 - 60}, abstract = {

In this work, we present the parallel implementation of three low-level vision algorithms, namely smoothing, histogram generation and edge detection by using the Sobel operator on the Homogeneous Multiprocessor. These algorithms were run on the simulator specifically developed for the Homogeneous Multiprocessor and the simulation experiments were used to establish the performance of these algorithms on the proposed architecture.

}, keywords = {Computer architecture, image processing, MIMO architecture, Multiprocessing, pattern recognition, vision}, issn = {0045-7906}, doi = {https://doi.org/10.1016/0045-7906(94)90006-X}, url = {http://www.sciencedirect.com/science/article/pii/004579069490006X}, author = {Ram Dantu and Dimopoulos, Nikitas and Li, Kinfu and Patel, Rajni and Al-Khalili, Asim} } @article {276, title = {Depth perception using blurring and its application in VLSI wafer probing}, journal = {Machine Vision and Applications}, volume = {5}, year = {1992}, month = {12/1992}, pages = {35{\textendash}45}, abstract = {

In this paper, we present a technique for measuring the amount of blur of an edge and using this information to determine the distance of a micromanipulator probe from a wafer surface in very large scale integration (VLSI) wafer probing. In this application, a soft and reliable touch of the probe with a metal pad in the wafer is a sensitive operation. The wafer is focused and several images of the probe while approaching the wafer are analyzed. In our theory, the amount of blur is calculated from the height of the step edge and the slope of the intensity profile at the zero crossing. Hence, our formula is simple and easy to use. We estimate the distance of the probe from the surface of the wafer and obtain a robust measure, i.e., one which is valid even in the presence of significant noise in the images. In order to validate our methods, we have experimented with various VLSI patterns as backgrounds.

}, issn = {1432-1769}, doi = {10.1007/BF01213528}, url = {https://doi.org/10.1007/BF01213528}, author = {Ram Dantu and Dimopoulos, Nikitas and Patel, Rajni and Al-Khalili, Asim} } @booklet {283, title = {Vision Algorithms For VLSI Wafer Probing}, year = {1990}, abstract = {

This paper deals with an important problem encountered in automating VLSI wafer probing. In this automation, vision is used for accurately guiding and lowering a probe to make contact with the wafer. In this paper, we discuss various algorithms used in measurement of the distance of the micro-manipulator from the wafer surface. In particular, we describe algorithms for alignment of consecutive frames of the wafer, separation of probe and wafer regions, and getting a clean image of the probe by eliminating traces of the background patterns. We also describe a three-level procedure for obtaining the proximity of the probe from the wafer. These algorithms are verified with the experimental data.

}, doi = {10.1117/12.969934}, url = {https://doi.org/10.1117/12.969934}, author = {Ram Dantu and Patel, Rajni and Dimopoulos, Nikitas and Al-Khalili, Asim} } @article {277, title = {Micromanipulator vision for wafer probing}, journal = {IEEE Transactions on Semiconductor Manufacturing}, volume = {2}, year = {1989}, month = {08/1989}, pages = {114-117}, abstract = {

An overview is presented of a micromanipulator vision system for use in automating various functions during the testing of a wafer for semiconductor parameters and inspection of VLSI circuits. It is assumed that the wafer under test is not necessarily in its proper orientation. It is required that certain probes be lowered automatically onto certain pads to inject test vectors and to read the results for analysis. A methodology was developed for determining the position (especially the vertical distance from the target) of the tip of a probe, so that it can be guided accurately to its target pad. Standard image processing steps used for efficient feature extraction and registration of the target integrated circuit are outlined, and a method of obtaining the vertical distance of the tip of a probe from its target pad is presented. Two different criteria through which it can be established whether a probe is in contact with its target are given. The algorithm developed was tested for touch using different types of tips such as tungsten and tungsten carbide, and with NMOS and CMOS processes. Clean and accurate representations of the probes were extracted from integrated images in all the tests, and in all cases, touch was achieved without the surface being scratched

}, keywords = {Automatic testing, automating various functions, Circuit testing, CMOS processes, computer vision, computerised picture processing, efficient feature extraction, image processing steps, Inspection, inspection of VLSI circuits, Machine vision, micromanipulator vision system, Micromanipulators, NMOS ICs, overview, Probes, registration, Semiconductor device testing, System testing, Tungsten, vertical distance, Very large scale integration, VLSI, W tip, wafer probing, WC tip}, issn = {0894-6507}, doi = {10.1109/66.29680}, author = {Ram Dantu and Dimopoulos, Nikitas and Patel, Rajni and Al-Khalili, Asim} } @conference {284, title = {A micro-manipulator vision in IC Manufacturing}, booktitle = {Proceedings. 1988 IEEE International Conference on Robotics and Automation}, year = {1988}, month = {Apr}, abstract = {

An overview is presented of a micromanipulator vision system for use in automating various functions during the testing of a wafer for semiconducting parameters and inspection of VLSI circuits. Positioning the probe and touching a test pad are the chief concern of the work desired. A brief description of the experimental setup is given. The image processing techniques used in identifying and controlling the location of various components such as the probes and the test pads are discussed. The vision modules and an expert system using hierarchical plan generation to control the sequence of plans are included

}, keywords = {Automatic testing, Circuit testing, computer vision, computer vision module, computerised pattern recognition, expert system, expert systems, IC Manufacturing, image processing, industrial robots, Inspection, integrated circuit manufacture, integrated circuit testing, Machine vision, Manufacturing, micromanipulator vision, Micromanipulators, Probes, robots, Semiconductivity, Semiconductor device manufacture, Semiconductor device testing, System testing, test pads, VLSI, wafer testing}, doi = {10.1109/ROBOT.1988.12271}, author = {Ram Dantu and Dimopoulos, Nikitas and Patel, Rajni and Al-Khalili, Asim} }